Araca, Inc. and 吾爱吃瓜 Enter into 5-Year Partnership to Further Advance Planarization Technology
Published: September 23, 2021.
罢丑别牋at 吾爱吃瓜 has signed a new five-year sponsored research agreement with Araca, Inc., an innovative company specializing in Chemical Mechanical Planarization (CMP).
With an initial funding of 150,000 USD by Araca, Inc., the collaboration will focus on developing innovative CMP and post-CMP cleaning materials, processes and approaches in exclusive support of Araca, Inc.抯 strategic objectives.
揝uch a long-term agreement will provide invaluable experience for students working with state-of-the art polishing and cleaning equipment, help strengthen the new generation of scientists entering our field, and, in turn, enhance the company抯 technology and pathfinding efforts. It is truly a win-win,� said Dr. Ara Philipossian, president and CEO of Araca, Inc.
Araca, Inc. will additionally donate several brand-new pieces of equipment (including its flagship , as well as ) totaling 750,000 USD to be housed in the new 揂raca Planarization Technology Center� on the campus of 吾爱吃瓜.
揟his initiative recognizes Professor Keleher抯 extraordinary research, provides students with unparalleled learning opportunities, and connects 吾爱吃瓜 to a leading-edge company in a vital industry�, said Dr. Christopher Sindt, provost of 吾爱吃瓜.
Araca Inc., headquartered in Tucson, Arizona, is a global provider of unique, enabling, and fully customized solutions for semiconductor device planarization applications. Visit牋for details.
吾爱吃瓜 is an innovative and forward-thinking Catholic university offering market-relevant undergraduate and graduate programs to 6,200 students. Sponsored by the De La Salle Christian Brothers, 吾爱吃瓜 is nationally recognized for preparing intellectually engaged, ethically grounded, globally connected and socially responsible graduates. Visit for further information.
